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| SD1894 RF & MICROWAVE TRANSISTORS SATELLITE COMMUNICATIONS APPLICATIONS .CLASSC .1. . .REFRACTORY/ .EFFI . 6 GHz COMMON BASE GOLD METALLIZATION CIENCY = 50% MIN. POUT = 4.5 W MIN. WITH 10 dB GAIN .250 x .320 2LFL (M170) epoxy sealed ORDER CODE SD1894 BRANDING SD1894 PIN CONNECTION DESCRIPTION The SD1894 is a common base silicon NPN bipolar device optimized for 1.6 GHz SATCOM applications. The SD1894 offers superior gain and collector efficiency, making it an ideal choice for Class C power amplifiers used in portable as well as fixed SATCOM terminals. 1. Collector 2. Emitter 3. Base ABSOLUTE MAXIMUM RATINGS (T case = 25C) Symbol Parameter Valu e Unit VCBO VCES VEBO IC PDISS TJ TSTG Collector-Base Voltage Collector-Emitter Voltage Emitter-Base Voltage Device Current Power Dissipation Junction Temperature Storage Temperature 45 45 3.0 375 12.5 +200 - 65 to +150 V V V mA W C C THERMAL DATA RTH(j-c) Junction-Case Thermal Resistance 14.0 C/W February 4, 1997 1/4 SD1894 ELECTRICAL SPECIFICATIONS (T case = 25C) STATIC Symbol Test Conditions Min. Value Typ. Max. Unit BVCBO BVCES BVEBO ICBO hFE IC = 1 mA IC = 1 mA IE = 1 mA VCB = 28 V VCE = 5 V IE = 0 mA VBE = 0 V IC = 0 mA IE = 0 mA IC = .2 A 45 45 3.0 -- 15 -- -- -- -- -- -- -- -- .25 150 V V V mA -- DYNAMIC Symbol Test Conditions Min. Value Typ. Max. Unit PIN c PG f = 1650 MHz f = 1650 MHz f = 1650 MHz VCC = 28 V VCC = 28 V VCC = 28 V POUT = 4.5 W POUT = 4.5 W POUT = 4.5 W POUT = 4.5 W VSWR = 20:1 -- 50 10.0 .35 55 11.1 .45 -- -- W % dB Load VCC = 28 V Mismatch No Degradation in Output Power INPUT POWER vs OUTPUT POWER 2/4 SD1894 IMPEDANCE DATA TYPICAL INPUT IMPEDANCE ZIN FREQ. 1600 MHz 1620 MHz ZIN () 31.6 + j 21.4 38.0 + j 15.0 36.0 + j 9.1 34.3 + j 8.77 ZCL () 5.2 + j 14.7 5.6 + j 14.55 6.1 + j 14.3 6.37 + j 14.2 TYPICAL COLLECTOR LOAD IMPEDANCE ZCL 1635 MHz 1650 MHz 1665 MHz 38.8 + j 11.3 5.85 + j 14.45 TEST CIRCUIT C1 : .6 - 4.5 pf Johanson C2 : 39pf ATC Chip Capacitor C3 : .1f Ceramic L1 : 10 Turns, AWG #28, .080"I.D. L2 : 4 Turns, AWG #28, .)80" I.D. Board Material: Er = 10.2, Thickness .050" 3/4 SD1894 PACKAGE MECHANICAL DATA Ref.: Dwg. No.12-0170 UDCS No. 1010996 rev B Information furnished is believed to be accurate and reliable. However, SGS-THOMSON Microelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of SGS-THOMSON Microelectronics. Specifi cations mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. SGS-THOMSON Microelectronics products are not authorize d for use as criti cal components in life support devices or systems without express written approval of SGS-THOMSON Microelectronics. (c)1997 SGS-THOMSON Microelectronics - All Rights Reserved SGS-THOMSON Microelectronics GROUP OF COMPANIES Australia - Brazil - Canada - China - France - Germany - Italy - Japan - Korea Malaysia - Malta - Morocco - The Netherlands - Singapore - Spain - Sweden - Switzerland Taiwan - Thailand - United Kingdom - U.S.A. 4/4 |
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